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Package sizes introduction

Author:GLICHN Date:7/19/2011 10:45:29 PM
Package sizes introduction ;
Surface mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC). These include:
 Two-terminal packages Rectangular passive components (mostly resistors and capacitors): 01005 (0402 metric): 0.016 × 0.008 in (0.41 × 0.20 mm) Typical power rating for resistors 1/32 watt
 0201 (0603 metric): 0.024 × 0.012 in (0.61 × 0.30 mm) Typical power rating for resistors 1/20 watt
 0402 (1005 metric): 0.04 × 0.02 in (1.0 × 0.51 mm) Typical power rating for resistors 1/16 watt
 0603 (1608 metric): 0.063 × 0.031 in (1.6 × 0.79 mm) Typical power rating for resistors 1/16 watt
 0805 (2012 metric): 0.08 × 0.05 in (2.0 × 1.3 mm) Typical power rating for resistors 1/10 watt
 1206 (3216 metric): 0.126 × 0.063 in (3.2 × 1.6 mm) Typical power rating for resistors 1/8 watt
 1210 (3225 metric): 0.126 × 0.1 in (3.2 × 2.5 mm) Typical power rating for resistors 1/4 watt
 1806 (4516 metric): 0.177 × 0.063 in (4.5 × 1.6 mm)
 1812 (4532 metric): 0.18 × 0.12 in (4.6 × 3.0 mm) Typical power rating for resistors 1/2 watt
 2010 (5025 metric): 0.2 × 0.1 in (5.1 × 2.5 mm) Typical power rating for resistors 1/2 watt
 2512 (6432 metric): 0.25 × 0.12 in (6.3 × 3.0 mm) Typical power rating for resistors 1 watt
 
Tantalum capacitors:[4] EIA 3216-12 (Kemet S, AVX S): 3.2 mm × 1.6 mm × 1.2 mm
 EIA 3216-18 (Kemet A, AVX A): 3.2 mm × 1.6 mm × 1.8 mm
 EIA 3528-12 (Kemet T, AVX T): 3.5 mm × 2.8 mm × 1.2 mm
 EIA 3528-21 (Kemet B, AVX B): 3.5 mm × 2.8 mm × 2.1 mm
 EIA 6032-15 (Kemet U, AVX W): 6.0 mm × 3.2 mm × 1.5 mm
 EIA 6032-28 (Kemet C, AVX C): 6.0 mm × 3.2 mm × 2.8 mm
 EIA 7260-38 (Kemet E, AVX V): 7.2 mm × 6.0 mm × 3.8 mm
 EIA 7343-20 (Kemet V, AVX Y): 7.3 mm × 4.3 mm × 2.0 mm
 EIA 7343-31 (Kemet D, AVX D): 7.3 mm × 4.3 mm × 3.1 mm
 EIA 7343-43 (Kemet X, AVX E): 7.3 mm × 4.3 mm × 4.3 mm
 
Aluminium capacitors:[5][6][7] (Panasonic / CDE A, Chemi-Con B): 3.3 mm × 3.3 mm
 (Panasonic B, Chemi-Con D): 4.3 mm × 4.3 mm
 (Panasonic C, Chemi-Con E): 5.3 mm × 5.3 mm
 (Panasonic D, Chemi-Con F): 6.6 mm × 6.6 mm
 (Panasonic E/F, Chemi-Con H): 8.3 mm × 8.3 mm
 (Panasonic G, Chemi-Con J): 10.3 mm × 10.3 mm
 (Chemi-Con K): 13.0 mm × 13.0 mm
 (Panasonic H): 13.5 mm × 13.5 mm
 (Panasonic J, Chemi-Con L): 17.0 mm × 17.0 mm
 (Panasonic K, Chemi-Con M): 19.0 mm × 19.0 mm
 
SOD: Small Outline Diode SOD-523: 1.25 × 0.85 × 0.65 mm [8]
 SOD-323 (SC-90): 1.7 × 1.25 × 0.95 mm
 SOD-123: 3.68 × 1.17 × 1.60 mm
 SOD-80C: 3.50 × 1.50 × More info [9]
 
MELF (Metal Electrode Leadless Face): mostly resistors and diodes; barrel shaped components, dimensions do not match those of rectangular references for identical codes. MicroMelf (MMU) Size 0102: L:2.2 mm D:1.1 mm (solder pad fits rectangular 0805) 1/5 watt (0.2 W) 100 V
 MiniMelf (MMA) Size 0204: L:3.6 mm D:1.4 mm (solder pad fits rectangular 1206) 1/4 watt (0.25 W) 200 V
 Melf (MMB) Size 0207: L:5.8 mm D:2.2 mm 1 watt (1.0 W) 500 V
 
 
Three terminal packages SOT: small-outline transistor, with three terminals SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body: four terminals, one of which is a large heat-transfer pad [10]
 SOT-89: 4.5 mm × 2.5 mm × 1.5 mm body: three terminals, one of which extends to a large heat-transfer pad [11]
 SOT-23 (SC-59, TO-236-3): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: three terminals for a transistor [12]
 SOT-323 (SC-70): 2 mm × 1.25 mm × 0.95 mm body: three terminals [13]
 SOT-416 (SC-75): 1.6 mm × 0.8 mm × 0.8 mm body: three terminals [14]
 SOT-663: 1.6 mm × 1.6 mm × 0.55 mm body: three terminals [15]
 SOT-723: 1.2 mm × 0.8 mm × 0.5 mm body: three terminals: flat lead[16]***SOT-883 (SC-101): 1 mm × 0.6 mm × 0.5 mm body: three terminals: leadless [17]
 
DPAK (TO-252): discrete packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions [18]
 D2PAK (TO-263): bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions [19]
 D3PAK (TO-268): even larger than D2PAK [20]
 
Five and six terminal packages SOT: small-outline transistor, with more than three terminals SOT-23-5 (SOT-25): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: five terminals [21]
 SOT-23-6 (SOT-26): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: six terminals [22]
 SOT-23-8 (SOT-28): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: eight terminals [23]
 SOT-353 (SC-88A): 2 mm × 1.25 mm × 0.95 mm body: five terminals [24]
 SOT-363 (SC-88, SC-70-6): 2 mm × 1.25 mm × 0.95 mm body: six terminals [25]
 SOT-563: 1.6 mm × 1.2 mm × 0.6 mm body: six terminals [26]
 SOT-665: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals [27]
 SOT-666: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals [28]
 SOT-886: 1.5 mm × 1.05 mm × 0.5 mm body: six terminals: leadless
 SOT-891: 1.05 mm × 1.05 mm × 0.5 mm body: five terminals: leadless
 SOT-953: 1 mm × 1 mm × 0.5 mm body: five terminals
 SOT-963: 1 mm × 1 mm × 0.5 mm body: six terminals
 
 
Packages with higher terminal count (drawings of most of the following packages can be found on [15]) Dual-in-line Small-outline integrated circuit (SOIC): small-outline integrated circuit, dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
 J-Leaded Small Outline Package (SOJ): the same as SOIC except J-leaded [16]
 TSOP: thin small-outline package, thinner than SOIC with smaller pin spacing of 0.5 mm
 SSOP: Shrink Small-Outline Package, pin spacing of 0.635 mm or in some cases 0.8 mm
 TSSOP: Thin Shrink Small-Outline package.
 QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
 VSOP: Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
 DFN: Dual Flat No-lead, smaller footprint than leaded equivalent
 
Quad-in-line PLCC: plastic leaded chip carrier, square, J-lead, pin spacing 1.27 mm
 QFP: Quad Flat Package, various sizes, with pins on all four sides
 LQFP: Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
 PQFP: plastic quad flat-pack, a square with pins on all four sides, 44 or more pins
 CQFP: ceramic quad flat-pack, similar to PQFP
 MQFP: Metric Quad Flat Pack, a QFP package with metric pin distribution
 TQFP: thin quad flat pack, a thinner version of PQFP
 QFN: Quad Flat No-lead, smaller footprint than leaded equivalent
 LCC: Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
 MLP (MLF): Micro Leadframe Package (Micro Lead-Frame package) with a 0.5 mm contact pitch, no leads (same as QFN) [17]
 PQFN: Power Quad Flat No-lead, with exposed die-pad[s] for heatsinking
 
Grid arrays PGA: Pin grid array.
 BGA: ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
 LGA: An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
 FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
 LFBGA: low profile fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
 TFBGA: thin fine pitch ball grid array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
 CGA: column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
 CCGA: ceramic column grid array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
 μBGA: micro-BGA, with ball spacing less than 1 mm
 LLP: Lead Less Package, a package with metric pin distribution (0.5 mm pitch).
 
Non-packaged devices (although surface mount, these devices require specific process for assembly): COB: chip-on-board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
 COF: chip-on-flex; a variation of COB, where a chip is mounted directly to a flex circuit.
 COG: chip-on-glass; a variation of COB, where a chip is mounted directly to a piece of glass: typically an LCD.
 
There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.