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Compare reflow soldering ovens

Author:GLICHN Date:8/21/2012 12:20:57 AM

GLICHN low-volume bench-top/desk reflow soldering ovens are equipped for precise lead free reflow. Temperature range as high as 360, Nitrogen capability is designed on model SR352N. Programming easy, windows system is compatible. See SMT equipments or reflow ovens.



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Model

Reflow solder SR300C

Reflow oven SR352C

Reflow oven SR352N

Applicable solder type

Lead free and Lead

PCB size

280*310mm

11.02" *12.21"

250*350mm

9.84" *13.78"

250*350mm

9.84" *13.78"

Heating Method

Quartz IR Forced hot air convection

Temperature range

0--300

0--350

0--350

Temperature control

PID control: ±2

SSR

Warm-up time

approx 2 min

approx 2 min

approx 2 min

N2 consumption

No

No

2L/Min

N2 pressure

No

No

N2 system with flow control, 0.2-0.3Mpa

Exhaust requirement

6.3L/Min, 0.22CFM

Programming

Windows XP

Profile storage

unlimited

PC interface

Yes

Computer not included

Electrical

AC220V 50/60HZ

Power

1.5kw, 3.5kw(max)

1.8kw, 4.8kw(max)

1.8kw, 4.8kw(max)

Dimension

65 L*50 W*45 H cm

(25.6"*19.69"W*17.72"H)

65 L*50 W*45 H cm

(25.6"*19.69"W*17.72"H)

65 L*50 W*45 H cm

(25.6"*19.69"W*17.72"H)

Weight

50kg

50kg

50kg