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Lead free solder paste

Lead free solder paste
Product name:Lead free solder paste
Item:
Details:
Lead free solder paste

Alloy: Sn99Ag0.3Cu0.7
Size: μm : 25~45
Application: fine space (400μm), super fine space with NO.5
melting point: 217~219℃
metal content% : 89.5~90.2
conglutination: 700~1000Pa.s
life: 12 months
module life: 〉24 hours
printing speed: most 150mm/s
adhere time: 〉24 hours
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