Description
Spin Coater T200
T series of high-performance plastic machine Spin Coater uniform spin coating machine
Description:Mainly used in liquid, gel formation in the surface film.For silicon wafers, glass, ceramic, stainless steel, metal, etc. plate surface coating process.In research, education, production applications.
Model: T200
T200 spin coating machine: for working chamber diameter D290mm D10mm-280mm wafer diameter and 200mmX200mm square pieces.
Derivatives are:T200D spin coating machine; work independent of the host, the controller division.
T200Q spin coating machine; the work of the host independent and can be installed countertops embedded controller division.
T300 spin coating machine: for working chamber diameter D370mm D10mm-360mm wafer diameter and 254mmX254mm square pieces.
Derivatives are:T300D spin coating machine; work independent of the host, the controller division.
T300Q spin coating machine; job embedded host independent and countertops installation, the controller division. Main features:* 26 high-precision process control:Can be set to store 26 different samples of the spin coating process;Each coating process step can be set to 51 different speed state;Acceleration (and deceleration), can be set.Two operating systems in English available.Reside within the operating system during the coating process template program for quick debugging and stored procedures.Setup: Universal symbol of international standards, 6 key operation, man-machine interactive dialogue prompts.No training, to get started would be operating.* Epoxy machine can be connected to automatically control the moment necessary Epoxy, Epoxy quantitative automatic repeat.Repeated precise automatic
