Description
Automatic Solder Paste Printer GL4034
Product Functions:
GL4034 a high accuracy printing robot designed for high precision screen printing or stencil printing in SMT industry.
Product Features:
a) Support wide spectrums of PCB sizes from 50mm x 50mm to 400mm x 340mm and PCB thickness from 0.6mm to 6mm.
b) High printing resolution:
1. High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm
2. Support glue printing.
c) Automatic control improves production efficiency, quality control and saves production cost:
1. Automatic PCB calibration
2. Squeegee pressure adjustable
3. Automatic printing
4. Automatic stencil cleaning (dry-type and wet-type)
d) Adopt company independently developed suspended print head with programmable pressure adjustment. Support on-line real time pressure feedback and automatic squeegee pressure balancing.
e) Programmable motor controls separation speed and distance among squeegee, stencil and substrate, to realize multi-method separation.
f) Multi-functional PCB positioning system for convenient and accurate PCB positioning.
g) Programmable PCB lifting platform ensure the PCB to lift to a proper height
h) Upward and downward visual positioning.
i) Built-in image processing system
Applicable pitches of Components
a) SMT Components such as resistors, capacitors, inductors, diode and triode: 01005, 0201, 0402, 0603, 0805, 1206 and other specifications
b) IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm
c) Printing size:50mm x 50mm ~400 mm x 340 mm
d) PCB Thickness:0.6 mm ~ 6 mm
e) FPC Thickness:less than 0.6 mm (excluding jig)
Applicable PCB types
Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products.
Specification
Items | Parameter | ||
Repeat Position Accuracy | ±0.01mm | ||
Printing Accuracy | ±0.025mm | ||
Cycle Time | <9s (Excluding Printing & Cleaning) | ||
Products Changeover | <5Min | ||
Screen Stencil Size/Min | 470mm X 370mm | ||
Screen Stencil Size/Max | 737mm X 737mm | ||
Screen Stencil Size/Thickness | 20mm ~ 40mm | ||
PCB Size/Min | 50X50mm | ||
PCB Size/Max | 400X340mm | ||
PCB Thickness | 0.6~6mm | ||
PCB Warpage Ratio | ＜1%（Based on diagonal length） | ||
Bottom of Board Size | 10mm | ||
Edge of Board Size | 3mm | ||
Transport Height | 900±40mm | ||
Transport Direction | Left-Right; Right-Left; Left-Left; Right-Right | ||
Transport Speed | 100-1500mm/sec Programmable | ||
Board Location | Support System | Magnetic pin/Side support block/Flexible automatic pin（optional） | |
Clamping System | Elastic side clamping/ Elastic Z-direction tabletting (optional, but not suggested) | ||
Print head | Programmable motor driven print head(optional pneumatic control print head) | ||
Squeegee Speed | 10~150mm/sec Programmable | ||
Squeegee Pressure | 0-15kg programmable | ||
Squeegee Angle | 60°(Standard)/55°/45° | ||
Squeegee Type | Steel squeegee (standard), rubber squeegee, other types of squeegee customizable. | ||
Stencil Separation Speed | 0.01~10mm/sec Programmable | ||
Cleaning Method | Dry-type, wet-type ( Programmable combination of the two cleaning methods） | ||
Table Adjustment Range | X: ±4mm;Y:±6mm;θ:±2° | ||
Type of Image Fiducial Mark | Standard geometry shape of fiducial mark, bonding pad / stencil hole | ||
Camera System | Single digital camera with upward/downward vision system | ||
Air Pressure | 4~6Kg/cm2 | ||
Air Consumption | Approx. 0.07m3 /min | ||
Control Method | PC Control | ||
Power Supply | AC:220±10%,50/60HZ 1Φ 1.5KW | ||
Machine Dimensions | 1410mm(L) x 1215mm(W) x 1550(H)mm | ||
Weight | Approx:1000Kg | ||
Operation Temperature | -20°C ~ +45°C | ||
Operation Humidity | 30%~60% | ||
