Automated optical inspection AOI4535 （Offline check）

PCB   dimension

20×20mm-450×350mm

PCB   thickness

0.3-5.0mm

PCB   space

top：≤30mm；bottom:≤45mm

Inspection

items

After   stencil printing

 Solder   paste unavailability, insufficient or excessive solder paste, solder paste   misalignment, solder paste bridging, stain , scratch and so on.

Before   or after  reflow soldering

Missing   or excessive component, misalignment, uneven, edging defect, opposite   mounting , wrong polarity, wrong or bad components.

Before   or after DIP wave soldering

Excessive   or missing component, empty soldering, solder balls, solder misalignment,   edging defect, bridging, IC NG, copper stain etc.

Visual   system

Image   system

CCD   camera, DAHENG 500 million px

Lighting   system

Three-channel   white led light source or RGB light source

Resolution   ratio

18um(FOV dimension：28.8 mm×21.6 mm)

Inspection   mode

Color calculation,   color extraction, gray-scale operations, image matching, etc

Mechanical   system

X/Y   driving system

AC   servo motor, Precision grinding ball screw

PCB   fixing mode

Auto   fixture

Positioning   accuracy

<8   um

Moving   speed

800mm/s(MAX)

Orbital   adjustment

Manual

Software   system

Operation   system

Windows   XP, ram 4GB

Interface   language

Chinese/English   optional

Inspection   output

PCB ID,   PCB description, component description,defect description, defect image

Power

AC220±10%，50/60HZ,1KW

Operation   temperature

-10-40℃

Operation   humidity

20-90%RH  non   condensing

Machine   dimension

900×1100×1300mm