Mini Selective Soldering Machine MF302

Description

Mini Selective Soldering Machine (Lead Free)---MF302

Description:
This inexpensive bench-top removes or installs through-hole components on SMT boards without damage to adjacent devices. It will process ICs, including DIPs, QFPs, PGAs, connectors and odd forms without reliance on slow, labor-intensive manual methods. The Mini Wave is ideal for short-runs requiring precision and repeatability. Simple to use, the operator first sets the soldering temperature desired from 0° to 400°C – covering any tin/lead or lead-free thermal requirement. The correct nozzle is then selected from the 3 that are included, with many additional custom nozzles also available. The wave is activated by an on/off switch while Z-motion wave immersion and dwell time is governed by foot switch. Component removal occurs when solder bonds are fluidized, allowing the operator to extract the component from the PCB. A replacement device can then be placed on the PCB. After prefluxing, the nozzle is positioned allowing soldering to take place.

Feature:
1. Removes and installs most through-hole devices on PCBs, without damage to adjacent surface mount components.
2. A compact, easy-to-use, low-cost machine with fast payback realized from labor savings alone.
3. Lead or lead-free compatibility, Temperatures adjustable to 400°C.
4. Wave is directly controlled by manual switch; solder bath dwell time controlled by foot pedal.
5. Includes customer's choice of 3 component nozzles from a total of 24 sizes available (see "Nozzles").

Specifications:

Nozzles sizes:

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